NI PXLe-1073

Core Technical & Performance Specifications

1. Slot Layout Configuration: Total 14 PXI Express slots, 1 dedicated system controller slot + 13 standard peripheral PXI Express instrument I/O slots; dedicated global star trigger synchronization slot integrated within multi-layer backplane PCB bus architecture
2. Backplane Synchronization Timing Specifications
   • Onboard ultra-low-jitter 10 MHz crystal oscillator shared system reference clock distributed uniformly to all fourteen chassis slots via matched-impedance high-speed clock signal traces
   • Full PXI Express standard star trigger bus, inter-slot local communication bus, multi-layer analog/digital trigger routing bus integrated within backplane multi-layer PCB layers
3. Electrical Power Supply Specifications
   • AC Input Voltage Universal Operating Range: 100–240 VAC nominal mains input voltage, continuous operating tolerance range 90–264 VAC
   • Input Mains Operating Frequency Band: 47–63 Hz, nominal global standard 50/60 Hz mains frequency
   • Rated Maximum Input Current Draw: 8 A at full maximum module load operating condition
   • Full-Load Integrated Switching Power Supply Efficiency Rating: ≥82% under 100% maximum rated multi-module load operating condition
   • Stabilized DC Backplane Power Output Rails: +3.3 V, +5 V, ±12 V; line voltage regulation performance ≤±0.1% for +5 V and ±12 V DC power rails, ≤±0.2% for +3.3 V DC power rail
   • Comprehensive integrated overvoltage, overcurrent, short-circuit and thermal overload hardware protection circuits for all DC backplane power output rails
4. Multi-Speed Cooling Fan Array & Acoustic Noise Specifications
   • Four independent brushless DC cooling fan units arranged in front intake rear exhaust forced-air cooling airflow topology; three programmable fan speed operating modes: LOW, MEDIUM, HIGH
   • Onboard high-precision multi-point thermistor temperature sensor array distributed across internal chassis airflow pathways for dynamic multi-fan speed adjustment logic based on real-time internal chassis intake and exhaust air temperature measurement values
   • Minimum acoustic noise emission performance at LOW fan speed quiet laboratory operating mode: 42 dBA sound pressure level measured per ISO 7779 standard operator-position noise measurement specification
5. Physical & Environmental Specifications
   • External Chassis Overall Dimensions: Width 432 mm, Height 177 mm, Depth 420 mm
   • Total Unloaded Chassis Unit Weight: 12 kg; maximum total loaded weight with fully populated fourteen instrument modules: 22 kg
   • Operating Ambient Temperature Range: 0 °C to 55 °C continuous full-load multi-module operation
   • Storage Temperature Range: -40 °C to 85 °C unpowered chassis storage condition
   • Relative Humidity Operating Rating: 10%–90% non-condensing ambient humidity environment
   • Maximum Operating Altitude: 2000 m above sea level

Key Functional Features

1. High-density fourteen-slot PXI Express chassis architecture combining dedicated integrated system controller slot and thirteen peripheral instrument I/O slots, supporting installation of large quantities of digitizers, SMUs, analog input/output modules, digital I/O modules and signal generator instruments within a single unified synchronized chassis unit for complex multi-instrument industrial automated test system deployment
2. Complete fully compliant PXI Express standard synchronization backplane infrastructure with ultra-low-jitter 10 MHz shared system reference clock, dedicated global star trigger slot, inter-slot local communication bus and multi-path bidirectional trigger routing bus, enabling nanosecond-scale precise time-aligned synchronized multi-module measurement, waveform generation and digital control sequencing operations for large-scale multi-instrument test platforms
3. High-capacity high-efficiency universal AC input integrated switching power supply unit capable of supplying stable multi-channel DC power rails to fully populated fourteen-slot chassis with maximum high-power SMU and digitizer module load configurations; automatic global mains voltage and frequency detection eliminates manual input voltage selection switches for worldwide industrial facility deployment compatibility
4. Four-unit independent brushless DC cooling fan array with three programmable fan speed operating modes and distributed multi-point internal chassis temperature sensor array for dynamic automatic fan speed adjustment logic; LOW fan speed mode minimizes acoustic noise emission for quiet laboratory and office-based test bench deployment, MEDIUM speed mode balances cooling airflow volume and noise level for standard mixed low-power and medium-power multi-module load operation, HIGH fan speed mode delivers maximum forced-air cooling airflow volume for continuous full-load operation with multiple high-power SMU and digitizer instrument modules installed within the chassis
5. Front-panel momentary standby power control switch for convenient full chassis system power cycling operation without complete disconnection of the main AC mains input power cable from the wall socket power outlet
6. Full mechanical industrial accessory compatibility suite: optional portable heavy-duty metal carrying handle kit for mobile field measurement deployment, standard 19-inch industrial equipment rack-mount bracket kit for permanent installation within factory production floor industrial test equipment cabinet racks, thick rubber anti-slip bottom feet for stable desktop laboratory bench placement
7. Comprehensive hardware resource configuration, diagnostic self-test and synchronization timing validation support functionality via NI MAX Measurement & Automation Explorer configuration software; automatic generation of standardized pxisys.ini system hardware definition file for complete chassis multi-module hardware identification, system memory and interrupt resource allocation, cross-module synchronization trigger bus routing configuration and remote chassis communication link setup for distributed large-scale industrial test systems
8. Robust industrial-grade mechanical enclosure construction with reinforced structural framing to withstand moderate mechanical vibration and shock exposure encountered within factory production floor and mobile field measurement deployment environments; integrated internal EMC electromagnetic compatibility shielding structures to minimize external industrial EMI noise interference on sensitive low-level analog measurement instrument modules installed within chassis peripheral slots