Product Short Description

AMAT Semiconductor Vacuum Seal Assembly 0100-71311

Product Brief

Integrated vacuum sealing assembly for AMAT semiconductor vacuum process equipment. It is applied to chamber door, pipeline interface and movable connection positions to maintain high vacuum environment inside process equipment.

Description

Model Series

AMAT 0100 Series Vacuum Sealing Components

Technical Specifications

  • Part Type: Integrated Vacuum Seal Assembly
  • Rated Vacuum Level: High vacuum standard for semiconductor process
  • Operating Temperature Range: -20 °C to 210 °C
  • Compression Ratio: Standard compression ratio for vacuum sealing
  • Gas Resistance: Resist all common semiconductor process gases

Functional Features

  1. Achieves reliable sealing for movable and fixed vacuum interfaces
  2. Maintains stable sealing performance under cyclic temperature changes
  3. Prevents external air and moisture from entering vacuum chamber
  4. Low outgassing to avoid contaminating process environment

Performance Parameters

  • Leakage Rate: Meet semiconductor high vacuum ultra-low leakage standard
  • Fatigue Resistance: Withstand thousands of opening and closing cycles
  • Elastic Retention: No permanent deformation under long-term compression
  • Outgassing Value: Complies with vacuum system outgassing limitation

Material Composition

  • Main Sealing Body: Perfluoroelastomer (Semiconductor Grade)
  • Reinforcement Frame: Lightweight corrosion-resistant alloy
  • Auxiliary Gaskets: Ultra-clean fluoropolymer material

Structural Characteristics

  • Composite multi-layer sealing structure
  • Frame-supported integral design for easy positioning
  • Continuous closed-loop sealing layout with no gap
  • Flexible deformation structure adapting to assembly tolerance

Working Principle

Installed at the joint gaps of vacuum equipment. It relies on elastic deformation to fill assembly gaps, isolates the internal vacuum space from external atmospheric environment, and maintains the constant vacuum degree required for wafer manufacturing processes.

Advantage Highlights

  1. Excellent elasticity and fatigue resistance for frequent cyclic use
  2. Outstanding chemical stability against corrosive process gases
  3. Ultra-low outgassing ensures process environment purity
  4. Integral assembly design simplifies on-site replacement work

Applicable Industries

Semiconductor manufacturing, vacuum electronic equipment, aerospace vacuum systems, precision electronic processing

Installation Requirements

  1. Install in ultra-clean workshop, keep sealing surface free of particles
  2. Avoid excessive stretching or twisting during assembly
  3. Keep compression volume within rated compression range
  4. Conduct vacuum holding test after installation

Usage Notes

  1. Replace according to service cycle even if no visible damage exists
  2. Do not contact sealing body with sharp tools or corrosive liquids
  3. Avoid long-term static compression under extreme temperature
  4. Store in dark, dry and sealed environment

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