Product Short Description

Product Name: LAM Research Semiconductor Process Component 810-800082-043

Model Series: LAM 810 Series Semiconductor Core Parts

Product Brief: Combined gas circuit control accessory for LAM semiconductor process equipment, applied to flow limiting and shunting of process auxiliary gas.

Description

Technical Specifications:
  • Rated Gas Flow: 0.5 ~ 10 L/min adjustable flow range
  • Working Air Pressure: 0.1 ~ 0.7MPa
  • Gas Medium: Adapt to nitrogen, argon and other inert process gases
  • Operating Temperature: 0°C ~ 75°C

    Functional Features: Gas flow regulation, gas circuit shunting, one-way cut-off, pressure stabilization and gas pipeline auxiliary protection.

    Performance Parameters:

  • Flow Regulation Accuracy: ±1% full scale precision
  • One-way Sealing Performance: No reverse gas leakage under rated pressure
  • Service Life: 40,000 hours continuous working life

    Material Composition: 316L stainless steel gas flow channel, PTFE sealing element, brass valve core, aluminum alloy integrated valve body.

    Structural Characteristics: Integrated multi-channel gas circuit structure, built-in one-way valve component, stepless flow regulating mechanism, threaded pipe connection structure.

    Working Principle: Change flow channel cross-sectional area through internal regulating mechanism to adjust gas flow rate; prevent gas backflow via one-way valve; stabilize output gas pressure inside pipeline.

    Advantages & Highlights: High flow regulation precision, corrosion resistance for inert gas, one-way anti-backflow function, compact integrated structure, stable air pressure output.

    Applicable Industries: Semiconductor thin-film process, semiconductor etching process, vacuum gas supply system, electronic special gas delivery.

    Installation Requirements: Connect gas pipeline according to flow direction mark; screw joint tighten to standard torque; conduct air tightness test with nitrogen after installation; no air leakage allowed.

    Usage Notes: Only use specified inert process gas; regularly clean internal pipeline every 6 months; slowly adjust flow rate to avoid sudden pressure change; close front valve before disassembly.

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