Product Short Description
- Product Name: Semiconductor Plasma Reaction Cavity Standard Component
- Brief Introduction: Standard version core component of LAM plasma process chamber, universal for multiple models of LAM etching equipment.
- Technical Specifications: Adaptable RF frequency 13.56 MHz, working temperature 5 °C to 145 °C, ultimate vacuum 1×10⁻⁸ Torr, structural strength withstand impact 15 N.
Description
- Functional Features: Constitutes main body of plasma reaction cavity, realizes gas isolation, vacuum maintenance and mechanical bearing of process chamber.
- Performance Parameters: Effective service life ≥ 52,000 working hours, sealing reliability 100% under rated working condition, anti-corrosion for fluorine-containing process gases.
- Material Composition: Sintered high-purity alumina ceramic + metal alloy sealing ring + high-temperature resistant bonding layer.
- Structural Characteristics: Standard circular structure, uniform wall thickness, integrated forming, external standard positioning holes for universal assembly.
- Working Principle: Provides closed and stable reaction space for plasma etching process, blocks process gas diffusion, and maintains long-term vacuum environment inside the chamber.
- Advantages: Universal compatibility for LAM multi-type equipment, stable physical and chemical properties, easy replacement and assembly, low maintenance cost.
- Applicable Industries: Semiconductor manufacturing, integrated circuit etching, MEMS device processing, semiconductor material deposition.
- Series Information: LAM 685 Series Universal Plasma Chamber Components, 001 is standard general version.
- Installation Requirements: Operate in Class 100 cleanroom; ensure no particle residue on contact surface; install horizontally with no offset.
- Usage Precautions: Avoid contact with metal hard objects; regular vacuum performance test every 2 months; do not use alternative non-original sealing parts.
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