Product Short Description
- Product Name: Semiconductor Vacuum Auxiliary Component
- Brief Introduction: Special vacuum matching component for LAM semiconductor production equipment, used in process chamber auxiliary systems.
- Technical Specifications: Working vacuum 5×10⁻⁸ Torr, maximum bearing pressure 0.8 MPa, operating temperature -10 °C to 130 °C, thread standard ANSI standard.
Description
- Functional Features: Assists vacuum maintaining, pipeline connection and pressure buffering in semiconductor process units; compatible with multiple process gas pipelines.
- Performance Parameters: Air tightness leakage rate ≤ 1×10⁻⁹ sccm/sec, cycle service life ≥ 45,000 hours, pressure bearing stability within ±0.01 MPa.
- Material Composition: Forged stainless steel body + copper alloy sealing ring + high-temperature resistant polymer lining.
- Structural Characteristics: Multi-channel integrated structure, built-in pressure buffer cavity, external standard flange connection, compact layout.
- Working Principle: Stabilizes internal vacuum degree of the equipment chamber, buffers instantaneous pressure fluctuation of gas pipelines, and ensures stable operation of vacuum system.
- Advantages: Excellent vacuum holding performance, strong pressure impact resistance, compact structure, good compatibility with original equipment.
- Applicable Industries: Semiconductor wafer fabrication, chip etching, plasma process, photovoltaic cell manufacturing.
- Series Information: LAM 605 Series Vacuum System Components, dedicated to LAM mainstream process platforms.
- Installation Requirements: Clean all connecting surfaces before installation; use special vacuum sealing grease; vertical/horizontal installation both available, no tilt beyond 0.2°.
- Usage Precautions: Do not disassemble under vacuum state; replace sealing accessories regularly every 6 months; keep the surface dry and dust-free.
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