Product Short Description
- Product Name: Semiconductor Process Component
- Brief Introduction: Precision custom component designed exclusively for semiconductor wafer processing equipment, matched with LAM series etching and deposition systems.
- Technical Specifications: Dimensional tolerance ±0.001 mm, operating voltage 0–24 V DC, operating temperature range 10 °C to 120 °C, vacuum environment adaptability 1×10⁻⁷ Torr.
Description
- Functional Features: Realizes mechanical positioning, gas flow auxiliary guidance and vibration damping in semiconductor process chambers; supports continuous 24-hour operation.
- Performance Parameters: Service life ≥ 50,000 working hours, repeat positioning accuracy 0.002 mm, corrosion resistance grade Class 1 for process gases.
- Material Composition: High-purity aluminum alloy base + fluoropolymer anti-corrosion coating + stainless steel fasteners.
- Structural Characteristics: Integrated modular structure, one-piece forming main body, embedded sealing structure, standard interface for quick assembly.
- Working Principle: Conducts mechanical limit and flow guiding under high-vacuum and high-temperature process environment, isolates process gas leakage and mechanical vibration transmission.
- Advantages: Ultra-high dimensional precision, excellent gas corrosion resistance, stable long-term operation, easy maintenance and replacement.
- Applicable Industries: Semiconductor manufacturing, integrated circuit fabrication, wafer etching, thin-film deposition.
- Series Information: LAM Standard Process Component Series, matched with LAM 2300/2900 process equipment families.
- Installation Requirements: Install in Class 100 cleanroom; use professional torque wrench for fastening; ensure horizontal installation with inclination ≤ 0.1°.
- Usage Precautions: Strictly avoid contact with acidic/alkaline chemicals; regular vacuum sealing inspection every 3 months; prohibit collision during handling.
Reviews
There are no reviews yet.