Description
Technical Specifications
- Application Environment: Semiconductor vacuum process chamber
- Operating Temperature: 0 °C ~ +100 °C
- Working Environment: High vacuum environment
- Surface Cleanliness: Semiconductor Class 100 Clean Grade
- Dimension: Standard matching size for AMAT equipment
- Surface Roughness: Ra ≤ 0.8 μm
Structural Features
Precision machined integral structure, smooth non-porous surface, precise assembly tolerance, vacuum sealing matching structure, no gap design for particle prevention.
Functional Characteristics
As core assembly part of semiconductor process equipment, undertake mechanical positioning, sealing connection and flow channel guiding functions inside vacuum chamber; ensure process environment stability.
Working Principle
Installed in the vacuum process chamber of semiconductor equipment, cooperate with surrounding components to form sealed vacuum space; maintain internal gas flow path and mechanical positioning accuracy, ensure normal progress of wafer processing technology.
Material Composition
Main body: Aerospace grade aluminum alloy / stainless steel (vacuum special material); Surface treatment: Electropolishing, passivation treatment; Auxiliary parts: High purity fluoropolymer sealing parts.
Advantages & Highlights
Ultra-high machining precision, non-particle shedding performance, excellent vacuum sealing performance, corrosion resistance to process gas, high surface cleanliness, stable performance in long-term vacuum environment.
Applicable Industries
Semiconductor wafer manufacturing, chip etching equipment, thin film deposition equipment, integrated circuit production, photovoltaic cell process equipment.
Installation Requirements
- Complete assembly in Class 100 clean room, wear professional clean room protective equipment.
- Do not touch the working surface with bare hands to prevent contamination.
- Install according to assembly mark and direction, ensure sealing surface fits completely.
- All fasteners are tightened in sequence according to standard torque.
Usage Notes
- Strictly prevent surface scratch, collision and contamination during handling and installation.
- Regularly inspect surface state and sealing performance in vacuum chamber.
- Replace parts according to equipment maintenance cycle.
- Use special semiconductor cleaning agent for surface cleaning only.
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