Product Short Description
AMAT Semiconductor Thermal Control Component 0100-76124
Product Brief
Precision thermal control accessory for AMAT semiconductor process equipment. It regulates and conducts heat inside process chambers, ensuring uniform temperature distribution during wafer thermal processing.
Description
Model Series
AMAT 0100 Series Thermal Management Components
Technical Specifications
- Part Type: Heat Conduction & Temperature Uniformity Component
- Rated Working Temperature: 30 °C to 230 °C
- Thermal Conductivity: High thermal conductivity grade for semiconductor equipment
- Operating Environment: Vacuum + process gas atmosphere
- Flatness: High-precision flatness for surface contact
Functional Features
- Rapidly conducts and transfers internal heat of process chamber
- Realizes uniform temperature distribution across wafer processing area
- Resists corrosion from process gases and plasma
- Maintains stable thermal performance under long-term continuous operation
Performance Parameters
- Temperature Uniformity: Strict temperature difference control over working surface
- Thermal Stability: No performance attenuation under cyclic temperature rise and fall
- Surface Flatness: No warping or deformation after long-term heating
- Particle Generation: Ultra-low particle shedding during thermal cycle
Material Composition
- Main Body: High-purity copper alloy with anti-corrosion treatment
- Surface Protective Layer: Semiconductor-grade inert coating
- Connection Parts: High-temperature resistant fasteners
Structural Characteristics
- Flat plate type integrated heat conduction structure
- Symmetrical internal flow channel for auxiliary temperature control
- Standard mounting holes for fixed installation
- Smooth surface to prevent particle accumulation
Working Principle
Closely attached to the heating unit and wafer bearing area. It transfers heat evenly to every position of the processing area, eliminates local overheating or cold spots, and keeps the wafer in a constant and uniform temperature environment to guarantee consistent process quality.
Advantage Highlights
- Superior thermal conductivity improves temperature control efficiency
- Anti-corrosion coating adapts to complex semiconductor process environments
- High structural flatness ensures full contact and heat transfer
- Long service life for 24-hour continuous production operation
Applicable Industries
Semiconductor thermal process, rapid thermal processing, wafer annealing process, thin film thermal deposition
Installation Requirements
- Complete installation in ultra-clean workshop with anti-static protection
- Ensure full surface contact between component and matching parts
- Fasten mounting parts evenly to avoid local stress deformation
- Calibrate temperature parameters after assembly
Usage Notes
- Keep surface clean to prevent dust from affecting heat conduction
- Do not scratch the protective coating during maintenance
- Inspect flatness regularly after long-term operation
- Operate strictly within rated temperature range
Reviews
There are no reviews yet.