Product Short Description
Product Name: VME Bus Single-Board Computer (SBC)
Product Introduction: The AMAT 0090-76110 is a high-performance VME bus single-board computer designed by Applied Materials for semiconductor manufacturing equipment. It serves as the core CPU board or SBC in systems such as the Applied Materials Precision 5000 series, part of the Synergy Microsystems V21 platform.
Description
Technical Specifications:
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Manufacturer: Applied Materials (AMAT)
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Model: 0090-76110
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Product Type: VME SBC
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Processor: Motorola PowerPC 7457
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CPU Speed: 1 GHz
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SDRAM: 512 MB
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Flash Memory: 2 GB
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Bus Standard: VME (VersaModule Eurocard)
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I/O Interfaces: Serial, Parallel, USB, PCI
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Operating Voltage: 5 VDC ±5% (VME bus powered)
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Power Consumption: 25 W
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Operating Temperature: -40 °C to +85 °C
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Board Material: FR-4 epoxy glass
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Surface Finish: Electroless Nickel Immersion Gold (ENIG)
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Solder Mask: OSP (Organic Solderability Preservative)
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Board Thickness: 1.6 mm
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Trace Width/Spacing: 5 μm / 5 μm
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Physical Dimensions: 233.4 mm × 160 mm (6U VME format)
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Weight: 0.5 kg
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Certification: ISO 9001
Functional Features: 1 GHz PowerPC 7457 processor delivers high-speed real-time data processing and complex control algorithm execution. 512 MB SDRAM + 2 GB Flash provide ample storage for firmware, process recipes, and data logging. Rich I/O (serial, parallel, USB, PCI) ensures broad peripheral compatibility. FR-4 substrate with ENIG surface finish and OSP pad protection ensures excellent solderability, corrosion resistance, and reliability under harsh industrial conditions. -40 °C to +85 °C operating range supports deployment in extreme environments.
Application Scenarios: Core control board for Applied Materials semiconductor manufacturing equipment (e.g., Precision 5000 series). Also suitable for industrial automation, data acquisition systems, signal processing, test & measurement equipment, and military/aerospace applications.
Installation & Notes: Standard 6U VME card, plugs into a VME-compliant chassis backplane. Ensure proper seating to avoid contact issues. The board’s wide temperature tolerance and industrial-grade design eliminate the need for specialized cooling in most semiconductor fab environments. Handle with ESD precautions during installation or removal.
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