Alcatel-Lucent M10-1GB-SFP-B

Core Technical Performance Parameters

1. Port Configuration: 10 × SFP MSA standard gigabit fiber slots (hot-pluggable)
2. Switching Capacity: 20 Gbps full-duplex non-blocking switching fabric
3. Packet Forwarding Rate: 14.88 Mpps (million packets per second)
4. Supported Optical Transceiver Types: 1000BASE-SX, LX, LH, ZX SFP modules
5. Communication Protocols: IEEE 802.1Q VLAN, 802.1p QoS priority queue, STP/RSTP/MSTP ring protection, DDM I2C digital monitoring
6. Power Input: 24 VDC ~ 55 VDC redundant dual terminal power supply
7. Environmental Rating
   • Operating Temperature: -40 °C ~ +75 °C (industrial extended temperature grade)
   • Storage Temperature: -40 °C ~ +85 °C
   • Relative Humidity: 5% – 90% RH non-condensing
8. Physical Mechanical Specs
   • Protection Class: IP30 metal front panel housing
   • Mounting: Hot-swap plug-in for OmniSwitch chassis, front pull tab lock mechanism

Material Composition

• Front Panel: Cold-rolled steel plate with black matte electrostatic coating, ESD grounding strip integrated
• Main PCB: High-density multi-layer FR4 PCB with gold-plated SFP slot contacts and backplane connectors
• SFP Slot Housing: High-temperature LCP flame-retardant plastic with ESD conductive coating
• Internal Heat Spreader: Thin copper alloy sheet for chip heat dissipation
• Pull Lock Mechanism: Die-cast zinc alloy with spring stainless steel latch
• PCB Conformal Coating: UV-cured acrylic anti-moisture, anti-dust protective film

Structural Characteristics

1. Full hot-swappable plug-in card design, supports online insertion/removal without shutting down main chassis switch
2. Front panel arranged with 10 independent SFP transceiver bays, each equipped individual link/activity LED indicator
3. Dual redundant power supply input terminals on rear backplane connector, internal power isolation protection circuit
4. Built-in independent switching ASIC chip per card, distributed forwarding architecture to avoid single-point bandwidth bottleneck
5. Vertical internal air duct matching chassis fan cooling airflow, passive copper heat spreader without independent fan
6. Integrated ESD surge protection circuit on all SFP port signal lines, complies with IEC 61000-4-2 ESD standard

Working Principle

1. Optical signal from remote equipment enters SFP transceiver inserted into M10-1GB-SFP-B slot, converted into electrical gigabit serial data stream.
2. Onboard dedicated switching ASIC processes data frames, performs VLAN tagging, QoS queue scheduling, ring network redundancy path calculation and packet forwarding.
3. DDM I2C bus real-time reads SFP module operating parameters: transmit optical power, receive optical power, module temperature, supply voltage for remote network monitoring.
4. Data frames are forwarded to backplane chassis switching fabric, or routed to other SFP ports on the same line card based on MAC address table lookup.
5. Built-in ring protection logic automatically switches traffic to backup fiber link within 50 ms upon primary fiber link failure, realizing uninterrupted data transmission.

Installation Requirements

1. Chassis power must remain powered on during hot swap; hold front pull tab firmly to fully insert card until latch clicks locked
2. Discharge human body static electricity via chassis grounding bar before touching SFP modules or line card ports
3. Insert SFP transceivers with bale latch facing upwards; LC fiber patch cord must be dust-capped when unused
4. Fiber cable bend radius maintained ≥30 mm to prevent optical signal attenuation
5. Chassis cooling fan must operate normally; blocked air duct will trigger card over-temperature protection shutdown
6. For industrial outdoor cabinet deployment, additional cabinet temperature control air conditioner required to avoid exceeding +75 °C operating limit

Function & Feature Highlights

1. 10-port independent gigabit fiber aggregation, non-blocking full-duplex switching architecture
2. Full hot-swappable design, zero service interruption during module replacement or expansion
3. Built-in DDM digital diagnostic monitoring for real-time optical link health status remote query
4. Multi-layer ring network redundancy protocol support, sub-50 ms fast failover for industrial and carrier backbone networks
5. Extended industrial temperature range (-40 ~ +75°C), suitable for outdoor communication cabinet deployment
6. Hardware-based QoS priority scheduling, voice/video data stream low-latency transmission guarantee
7. Dual redundant power input circuit improves power supply reliability in unattended equipment rooms

Typical Application Scenarios

• Carrier metro Ethernet core aggregation switch fiber uplink card
• Large enterprise campus network core layer gigabit fiber aggregation
• Industrial factory redundant ring communication backbone switch interface module
• Smart city traffic monitoring, security camera fiber aggregation chassis
• Data center access switch uplink to distribution layer fiber connection
• Utility power grid substation industrial Ethernet communication equipment

Operation & Maintenance Precautions

1. Never insert/remove line card without holding pull tab; direct force on PCB will damage rear backplane golden fingers
2. SFP transceiver optical window must keep dust-proof caps installed when no fiber connected; dust contamination causes signal loss
3. Quarterly inspect front panel LED status, record abnormal link down or over-temperature alarms
4. Annual clean chassis air filter to maintain normal heat dissipation airflow
5. Do not use in environments with corrosive gas, conductive metal dust or continuous water spray
6. Unused spare line cards must be stored in anti-static shielding bags with desiccant
7. Avoid bending fiber patch cords sharply; long-term small-radius bending permanently damages optical fiber core