ABB LWN2660-6EG 3BHL000986P7002

Technical Specifications

• Base Model Number: LWN2660-6EG
• Unique Factory Trace Part Code: 3BHL000986P7002
• Nominal DC Bus Rated Voltage: 1800 V DC
• Continuous Rated Collector Current: 2600 A DC
• Configurable IGBT Switching Frequency Band: 500 Hz ~ 3000 Hz
• Permitted IGBT Junction Operating Temperature Range: -40°C ~ +125°C
• Storage Temperature Range: -55°C ~ +150°C
• Mandatory Cooling Type: Liquid water-glycol cold plate direct contact cooling
• Onboard Field Bus Interface: PROFIBUS-DP compliant with EN 50170 industrial standard
• Auxiliary Digital Channel Layout: 8 galvanically isolated digital input channels, 8 isolated digital output channels
• Hardware Protection Mechanisms: Overcurrent interlock, DC bus overvoltage interlock, junction overtemperature interlock, gate drive fault interlock
• Enclosure Ingress Protection Grade: IP20, limited to indoor converter cabinet installation
• Module Overall Net Weight: 24.6 kg
• Insulation Withstand Voltage Between Power Circuit and Control Logic: 4000 V AC / 1 min

Function Features

1. Large-area silicon IGBT chip array customized for medium voltage grid power conversion, supporting bidirectional energy flow
2. Optimized carrier lifetime chip design cuts switching power loss, lowers cooling system load and reduces overall equipment energy consumption
3. Integrated 16-channel isolated digital auxiliary I/O for internal cabinet interlock signal transmission, cooling system status feedback and external fault chain linkage
4. Embedded precision NTC temperature sensor directly bonded to DBC substrate for real-time junction temperature tracking and instantaneous thermal overload protection
5. Dedicated PROFIBUS-DP communication interface uploads real-time operating current, DC bus voltage, junction temperature and fault code data to converter master CPU for centralized monitoring and fault logging
6. Built-in gate drive short-circuit detection circuit with microsecond-level hardware trip response to prevent permanent chip breakdown

Performance Parameters

• Full-load nominal power conversion efficiency: 98.7%
• Overtemperature hardware trip threshold: 125°C junction temperature
• Short-circuit withstand duration before hardware cut-off: 10 μs
• Thermal resistance (Junction to cold plate): 0.008 °C/W
• MTBF value under standard cooling condition (80°C cold plate medium): 160,000 hours
• Digital channel signal isolation resistance: ≥1000 MΩ
• Maximum allowable coolant flow rate: 25 L/min
• Coolant operating temperature window: 5°C ~ 55°C

Material Composition

• Insulated substrate base: Aluminum Nitride (AlN) Direct Bonded Copper (DBC) ceramic plate
• Power switching core components: High-power silicon IGBT semiconductor dies
• Internal chip interconnection medium: Ultrasonic bonded high-purity aluminum bonding wires
• Outer module housing: Flame-retardant high-temperature PPO engineering plastic
• Thermal interface filling material: High thermal conductivity silicone thermal grease compound
• External high-current power terminals: Thick copper bar with full tin plating anti-oxidation treatment
• Control signal terminal base: Glass-filled flame-retardant PA66 plastic with gold-plated contact pins
• Internal sealing material: High-temperature silicone elastomer

Structural Characteristics

• Rectangular flat block integrated monolithic module structure for cold plate surface mounting
• Two groups of thick copper busbar power terminals distributed on both long sides of housing for parallel DC bus connection
• Independent control signal terminal strip installed on one short edge for PROFIBUS and auxiliary digital I/O wiring
• Uniformly distributed threaded mounting holes at four corners of module base for tight laminating contact with liquid cooling cold plate
• Segregated internal layout: independent power chip zone, gate drive PCB zone, temperature sensing circuit zone to eliminate high-frequency electromagnetic interference
• Sealed internal cavity structure preventing coolant vapor, dust and conductive particles from contacting semiconductor chips

Working Principle

Advantage Highlights

1. High-current 2600A rated capacity reduces total module quantity for large-capacity medium voltage converters, lowering cabinet volume and overall system cost
2. Aluminum Nitride DBC substrate delivers ultra-low thermal resistance, compatible with high-load continuous operation and long service life
3. Bidirectional power flow design supports both motor drive and grid energy storage charge-discharge dual working modes
4. Integrated digital auxiliary I/O eliminates external signal isolation relay modules, simplifying cabinet wiring layout
5. Standard PROFIBUS-DP communication realizes seamless data interaction with ABB all-series medium voltage converter control systems
6. Multi-layer hardware protection architecture avoids single-point failure leading to module burnout

Applicable Industries

Installation Requirements

1. Mount module flat on liquid cold plate surface, evenly torque four-corner mounting bolts to 8 N·m with uniform pressure to eliminate thermal air gaps
2. Apply 0.1mm thickness standardized thermal grease between module base and cold plate before installation
3. Coolant pipeline must adopt deionized water mixed with ethylene glycol anti-freeze fluid, with filter installed at pipeline inlet to block solid impurities
4. High-current copper busbar wiring torque standard: 15 N·m per terminal bolt; use conductive anti-oxidation paste on contact surface
5. Separate power busbar wiring and control signal cables with minimum 40cm distance to avoid high-current electromagnetic interference
6. All control signal cables must adopt shielded twisted pair, single-point grounding at converter control cabinet only

Usage Precautions

1. Cut off high-voltage DC bus power and wait a minimum of 30 minutes for capacitor full discharge before disassembly or maintenance operations
2. Conduct quarterly cold plate and module base cleaning to remove accumulated scale and dust that deteriorates heat dissipation performance
3. Do not operate module continuously when coolant temperature exceeds 55°C; long-term high temperature will accelerate IGBT chip aging
4. Avoid frequent short-circuit test operation; repeated short-circuit impact will reduce chip service life significantly
5. Store spare modules in constant temperature dry anti-static cabinet with original sealed packaging, avoid exposure to damp, corrosive gas environment
6. Replace thermal grease every 24 months during routine cabinet overhaul to maintain heat transfer efficiency