Product Short Description
AMAT Semiconductor Plasma Shield Component 0100-71309
Product Brief
Original shielding component for semiconductor plasma process chambers. It isolates plasma radiation, protects internal chamber structures, and optimizes plasma distribution during etching and deposition processes.
Description
Model Series
AMAT 0100 Series Process Chamber Shield Parts
Technical Specifications
- Part Type: Plasma Protection Shield
- Working Environment: High-density plasma + vacuum atmosphere
- Maximum Continuous Temperature: 240 °C
- Plasma Resistance Grade: Semiconductor plasma resistant grade
- Cleanliness Class: Class 100 ultra-clean grade
- Surface Treatment: Plasma-resistant special coating
Functional Features
- Blocks plasma sputtering to prevent damage to chamber base components
- Optimizes internal plasma field distribution for uniform wafer processing
- Reduces particle contamination generated by plasma impact
- Maintains stable internal environment of process chamber
Performance Parameters
- Plasma Anti-Sputtering Performance: Long-term resistance to plasma ion bombardment
- Thermal Conductivity: Balanced thermal conductivity for uniform heat dissipation
- Service Life: Fixed service life under continuous plasma operation
- Dimensional Stability: No warping under long-term high temperature
Material Composition
- Base Material: High-purity aluminum alloy
- Surface Layer: Dense plasma-resistant ceramic coating
- Mounting Accessories: Corrosion-resistant stainless steel parts
Structural Characteristics
- Perforated & hollowed integrated shielding structure
- Uniform aperture layout for plasma penetration and distribution
- Edge reinforced structure for anti-sputtering enhancement
- Standard clamping and positioning structure for quick assembly
Working Principle
Installed surrounding the wafer processing area inside the vacuum chamber. It filters and distributes plasma, blocks high-energy plasma ions from directly impacting the chamber wall, and guides plasma to act evenly on the wafer surface, ensuring consistent process effect while protecting the main chamber body.
Advantage Highlights
- Special coating extends service life under long-term plasma bombardment
- Optimized structure ensures uniform plasma coverage across wafer surface
- Low particle generation conforms to semiconductor production standards
- Easy disassembly and installation for routine chamber maintenance
Applicable Industries
Semiconductor etching process, physical vapor deposition, chemical vapor deposition, semiconductor thin film processing
Installation Requirements
- Operate in Class 100 ultra-clean environment with professional maintenance tools
- Align positioning marks strictly during installation
- Ensure full contact between shield and mounting base to avoid local overheating
- Complete vacuum leakage test before putting equipment into production
Usage Notes
- Regularly check surface coating wear during equipment maintenance
- Replace once coating is damaged or excessive particles appear
- Do not use abrasive tools to clean the shielding surface
- Store in sealed ultra-clean packaging when removed from equipment
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