Product Short Description
Technical Specifications
- Input Voltage: Supports 120 VAC or 240 VAC single-phase/three-phase input.
- Continuous Current Rating: 12 ARMS (root mean square).
- Peak Current Rating: 18 ARMS.
- Output Power:
- 10,000 VA for 1 second at 240 VAC (three-phase).
- 8,000 VA for 1 second at 240 VAC (single-phase).
- Speed Loop Bandwidth: Up to 800 Hz for rapid dynamic response.
- Feedback Resolution: 24-bit high-resolution encoder feedback for sub-micron positioning accuracy.
- Communication Interfaces:
- Pre-installed SynqNet option card with standard RJ connectors.
- Optional EtherCAT or CANopen for real-time networking.
- Environmental Rating: IP20 protection for dust and liquid resistance.
- Operating Temperature: Continuous convection rating of 12.0 ARMS at 40°C ambient, 8.0 ARMS at 50°C ambient.
Description
Key Features
- High-Precision Control:
- Advanced servo algorithms ensure precise speed, position, and torque regulation.
- Sub-millisecond response time for dynamic motion profiling.
- Multi-Axis Synchronization:
- Supports independent control of multiple axes, enabling coordinated motion in robotics and CNC systems.
- Flexible Feedback Options:
- Compatible with incremental/absolute encoders and Hall-effect sensors for versatile feedback integration.
- Compact Design:
- Space-saving form factor with integrated power supply and controller circuits.
- Diagnostics & Maintenance:
- Built-in self-test routines and fault logging for quick troubleshooting.
- LED indicators for real-time status monitoring (power, communication, alarms).
- Energy Efficiency:
- Active power factor correction (PFC) reduces harmonic distortion.
- Regenerative braking options to recover energy during deceleration.
Applications
- Robotics: Precision control of robotic joints in pick-and-place, welding, and assembly systems.
- CNC Machinery: High-speed spindle and feed axis control for milling, lathes, and grinding machines.
- Medical Devices: Accurate motion control in surgical robots and imaging systems.
- Semiconductor Manufacturing: Nanometer-level positioning for wafer handling and inspection.
- Packaging: Synchronized motion for labeling, filling, and sealing equipment.
- Electronics Assembly: Fine-pitch component placement and soldering automation.
Additional Capabilities
- Software Integration: Compatible with Kollmorgen’s WorkBench software for configuration, tuning, and diagnostics.
- Scalability: Supports daisy-chaining multiple drives for synchronized multi-axis systems.
- Global Compliance: Meets international standards (UL, CE, IEC 61800-5-2) for global deployment.
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