GE IC200CHS006

Description

• Technical Specifications:
  • Module Compatibility: Supports all VersaMax fieldbus communications modules (IC200BEM001, IC200BEM002, IC200BEM003, etc.)
  • Mounting: 7.5 mm × 35 mm DIN rail (horizontal orientation); conductive, corrosion-resistant finish required for EMC grounding
  • Dimensions: 66.8 mm (2.63 in) × 133.4 mm (5.25 in) × 70 mm (2.75 in) (excluding DIN-rail height)
  • Weight: 0.23 kg (0.50 lbs)
  • Power Requirements: Backplane 5 VDC (1.2 A max); backplane 3.3 VDC (0.8 A max); no external power needed for carrier operation
  • Isolation: 250 VAC continuous / 1500 VAC for 1 minute (field-to-logic/frame ground)
  • Connectors: Carrier-to-carrier male/female backplane connectors; terminal blocks for fieldbus wiring (varies by module)
  • Mechanical Features: Module latch hole for secure retention; keying to prevent incorrect module insertion
  • Environmental Ratings: Operating temperature 0°C to +60°C; storage temperature -40°C to +85°C; humidity 5%–95% (non-condensing)
  • Terminal Blocks: Configurable for fieldbus wiring (number and type depend on the installed communications module)
  • EMC Compliance: Conforms to EN 61000-6-2 (immunity) and EN 61000-6-4 (emission) standards when mounted on grounded DIN rail
• Function Features:
  • Single Module Support: Dedicated to one VersaMax communications module, ensuring stable backplane communication and power delivery
  • Secure Installation: Module latch hole locks the communications module in place; keying prevents incorrect module insertion
  • Backplane Expansion: Carrier-to-carrier male/female connectors enable seamless backplane assembly without additional cables/tools
  • EMC Grounding: Requires grounded DIN rail for electromagnetic compatibility, reducing noise interference in industrial environments
  • Versatile Network Integration: Works with various fieldbus protocols (DeviceNet, Modbus, Genius) via compatible IC200BEM modules
  • No External Power: Operates solely on backplane power, simplifying installation and reducing wiring complexity
  • Field Wiring Flexibility: Terminal blocks support shielded cables for network connections, minimizing signal degradation
• Application Scenarios:
  • Industrial Network Integration: Connects VersaMax CPUs to DeviceNet, Modbus RTU/TCP, or Genius I/O networks in automotive, packaging, and material handling systems
  • Distributed Control Systems (DCS): Acts as a communication gateway between central PLCs and remote I/O racks in chemical, oil/gas, and water treatment plants
  • Power Generation/Distribution: Integrates with communications modules to monitor and control switchgear, transformers, and generator systems via Modbus or DNP3 protocols
  • Building Automation: Links HVAC, lighting, and security systems to VersaMax controllers using BACnet or Modbus communications modules
  • Manufacturing Automation: Facilitates data exchange between production line controllers and remote sensors/actuators in food & beverage, pharmaceutical, and electronics assembly lines
  • Remote I/O Expansion: Extends VersaMax I/O capacity by connecting to remote I/O networks, reducing wiring costs in large-scale facilities
• Installation & Maintenance:
  • Mounting: Snap onto grounded DIN rail (conductive, unpainted) for EMC compliance; ensure horizontal orientation for proper cooling
  • Module Installation: Align communications module with carrier keying, push until latched; verify module OK LED for power/communication status
  • Wiring: Use shielded cables for fieldbus connections; ground shields at the carrier terminal block to minimize noise; follow module-specific wiring diagrams
  • Configuration: Set network parameters (baud rate, address, protocol) via host PLC software; no on-carrier configuration required
  • Maintenance: Inspect DIN-rail grounding and carrier-to-carrier connections quarterly; check module OK LED for fault status during operation
  • Replacement: Direct drop-in for IC200CHS006; retain backplane configuration via host PLC and carrier-to-carrier communication