GE IC200CHS002

Description

• Technical Specifications:
  • Terminal Configuration: 36 IEC box – style terminals, divided into two groups: A1 – A18 and B1 – B18.
  • Wire Compatibility: Single wire: AWG #14 (2.1 mm²) to AWG #22 (0.36 mm²); Double wire: AWG #18 (0.86 mm²).
  • Electrical Ratings: Per – point current 2 A; Power/ground segment current 8 A; Voltage range 0 – 264 VAC; Transient voltage up to 300 VAC.
  • Power Consumption: Backplane 5 VDC (805 mA typical); Power dissipation 2.48 W (8.8 BTU/hour).
  • Mounting: 7.5 mm x 35 mm DIN rail (horizontal orientation); Panel – mountable for vibration/shock resistance.
  • Dimensions: 110.5 mm × 70 mm × 139.7 mm (excluding connectors).
  • Isolation: 250 VAC continuous / 1500 VAC for 1 minute (field – to – logic/frame ground).
  • Environmental Ratings: Operating temperature 0°C to +60°C; Storage temperature – 40°C to +85°C; Humidity 5% – 95% (non – condensing).
  • Keying: Configurable keying dials to match module keying positions.
  • Auxiliary Terminal: Supports additional bussed connection points.
• Function Features:
  • Single Module Support: Dedicated to one VersaMax I/O module, ensuring stable backplane communication and power distribution.
  • Secure Module Installation: Module latch hole locks the module in place; keying controls prevent incorrect module insertion.
  • Efficient Wiring: 36 IEC box – style terminals with transparent hinged door for protection and easy access.
  • Quick Backplane Assembly: Carrier – to – carrier male/female connectors eliminate extra cables/tools for backplane connections.
  • Flexible Mounting: DIN – rail mounting for standard applications; panel – mountable for high vibration/shock environments.
  • High Electrical Capacity: Handles 2 A per terminal and 8 A per power segment, supporting diverse industrial loads.
  • EMC Protection: DIN – rail grounding (conductive, unpainted) ensures electromagnetic compatibility.
• Application Scenarios:
  • Industrial Automation: Supports discrete/analog I/O modules in automotive, packaging, and assembly lines for sensor/actuator wiring.
  • Process Control: Integrates with analog modules in chemical, oil/gas, and water treatment plants for field signal connection.
  • Power Generation/Distribution: Connects to I/O modules monitoring transformer, switchgear, and generator status.
  • Building Automation: Links to HVAC, lighting, and energy management I/O modules for facility control systems.
  • Material Handling: Supports I/O modules controlling conveyors, cranes, and automated storage systems.
  • Food & Beverage Processing: Facilitates wiring for temperature, pressure, and flow I/O modules in production lines.
• Installation & Maintenance:
  • Mounting: Snap onto DIN rail (ground for EMC); use panel – mount for vibration/shock applications.
  • Wiring: Use shielded cables; ground shields at the carrier end; follow terminal numbering (A1 – A18, B1 – B18).
  • Keying Setup: Match keying dials to module keying positions before module insertion.
  • Module Installation: Align module with carrier, push until latched; verify with OK LED on the module.
  • Maintenance: Inspect terminals for corrosion/looseness; check DIN – rail grounding; replace carrier if terminals are damaged.
  • Replacement: Direct drop – in for IC200CHS002; retains keying and wiring configuration.