Densan DVESH7750

Description

Technical Specifications

• Bus Compatibility: VMEbus standard
• Form Factor: Standard VME PCB card
• Manufacturing Origin: Japan
• Built-in Signal Conditioning Circuit
• Operating Temperature Range: 5℃ to +45℃

Functional Features

• High-speed signal transmission between VME bus and external devices
• Built-in signal level conversion and conditioning circuit
• Stable performance in precision semiconductor inspection scenarios
• Plug-and-play design compatible with standard VME chassis

Application Scenarios

• Wafer defect inspection systems
• Semiconductor manufacturing test equipment
• Industrial vision inspection VME systems
• Precision measurement equipment control cabinets

Material Composition

• High-precision FR-4 PCB substrate
• Gold-plated signal connectors
• High-stability passive electronic components
• Flame-retardant solder mask layer

Structural Features

• Standard VME board size
• Edge connector for VME backplane connection
• Optimized on-board signal routing
• High-density component layout

Working Principle It receives control commands from the VME host system through the VME backplane, performs signal level conversion and conditioning processing, and transmits the processed signals to external detection units; meanwhile, it feeds back the field detection data to the VME control system.

Installation Requirements

• Install into the corresponding slot of a standard VME chassis
• Align and fully insert the backplane connector
• Tighten front panel screws to prevent loosening
• Keep away from strong electromagnetic interference sources

Usage Notes

• Implement electrostatic protection during disassembly and assembly
• Do not bend the circuit board or apply external force
• Power off before wiring or replacement operations
• Avoid dust and corrosive gas environments