Product Short Description

Product Name: Panasonic RN Series (ARN30) Microwave Relay — 8 GHz, 150 W carrying power.
Product Overview: The ARN30 is a compact surface-mount (SMD) microwave relay from Panasonic’s RN relay family, designed for high-frequency applications up to 8 GHz with a 150 W carrying power at 2 GHz. It is a 1 Form C (reversed contact type) RF relay with 50 Ω impedance.

Description

Technical Specifications (ARN30A4HZ as representative variant):
  • Frequency Range: Up to 8 GHz
  • Contact Arrangement: 1 Form C (Reversed contact type)
  • Impedance: 50 Ω
  • Rated Coil Voltage: 4.5 VDC (also available in 12 VDC and 24 VDC variants: ARN30A12, ARN30A24)
  • Rated Operating Power: 320 mW
  • Contact Material: Au (Gold) plating
  • Contact Carrying Power (CW): Max. 150 W at 20 °C, 2 GHz, 50 Ω, V.S.W.R. Max. 1.15 (with heat sink); Max. 100 W (without heat sink)
  • VSWR: Max. 1.1 (to 1 GHz), Max. 1.15 (1–2 GHz), Max. 1.2 (2–3 GHz), Max. 1.3 (3–6 GHz)
  • Insertion Loss: Max. 0.1 dB (to 1 GHz), Max. 0.12 dB (1–2 GHz), Max. 0.15 dB (2–3 GHz), Max. 0.5 dB (3–6 GHz)
  • Isolation: Min. 60 dB (to 1 GHz), Min. 55 dB (1–2 GHz), Min. 45 dB (2–3 GHz), Min. 30 dB (3–6 GHz)
  • Dielectric Strength: 500 Vrms for 1 min (between open contacts; between contact and coil)
  • Operate Voltage: Max. 75% V of rated coil voltage (initial, at 20 °C)
  • Release Voltage: Min. 10% V of rated coil voltage (initial, at 20 °C)
  • Expected Mechanical Life: Min. 10⁶ operations (switching frequency 180 times/min)
  • Expected Electrical Life: Min. 10⁶ operations (10 mA, 10 V DC resistive load); Min. 10³ operations (80 W at 2 GHz, 50 Ω, with heat sink, ON:OFF = 5 s:5 s)
  • Operating Temperature: -40 °C to +85 °C (allowable temperature -40 °C to +60 °C under standard packing condition)
  • Humidity: 5% to 85% RH (avoid icing and condensation)
  • Terminal Shape: Surface-mount terminal
  • Packing Style: Tape and reel packing (Z)
Key Features:
  • 150 W carrying power at 2 GHz
  • Excellent high-frequency characteristics with low insertion loss (Max. 0.12 dB at 2 GHz)
  • Compact SMD type for high-density PCB assembly
  • 50 Ω impedance matching for RF applications
  • RoHS compliant (does not contain 6 substances per EU RoHS Directive 2011/65/EU and 4 substances per 2015/863/EU)
Application Scenarios:
  • Base stations (transmitter section) — mobile phone, terrestrial digital, etc.
  • Measuring equipment — spectrum analyzers, oscilloscopes, etc.
  • High-frequency amplifier switching in wireless devices
Installation & Usage Notes:
  • Surface-mount onto PCB; since PCB design and heat dissipation conditions affect contact carrying power, verification under actual operating conditions is required
  • Heat sink required for high-power (150 W) operation at 2 GHz
  • When using in applications with low-level loads or high-frequency switching, consult the manufacturer
  • For applications between 6 GHz and 8 GHz, refer to the “REFERENCE DATA” in the datasheet

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