Schneider PC-E984-685

Technical & Performance Parameters

• Core Processor Architecture: 16-bit industrial dedicated logic processing chip
• User Logic Program Memory Capacity: 16K ladder logic program nodes
• Internal Data Register Storage Space: Complete 40000 numerical register address space for analog data storage, equipment state marking and calculation intermediate values
• Logic Scan Execution Speed: Fixed 2ms scanning time per 1000 program logic nodes, maintaining stable cycle speed under full program load
• Built-in Real-Time Clock Module: Independent time-of-day clock circuit powered by backup lithium battery, supporting automatic timing trigger logic and production batch time recording functions
• Power Input Specification: Universal AC dual-range input, 115V AC / 230V AC 50/60Hz frequency switching via external DIP dial switch on module casing
• Internal Rack Power Output Capacity: Supplies stable 5V DC logic bus power and 24V DC auxiliary field sensor power for all I/O modules installed on local backplane racks
• Maximum Local I/O Rack Driving Limit: Supports direct drive of up to 5 sets of Modicon 800 series standard I/O expansion racks without additional auxiliary power supply modules
• Total Full-Load Power Consumption of Complete CPU Module: 85W maximum power draw under full rack I/O load operation
• Backup Memory Battery Specification: Built-in replaceable lithium primary battery; the battery retains all user program and data register content for 12 consecutive months after complete system power loss; the shelf service life of new spare batteries reaches 5 years
• Communication Interface Configuration
  1. Dual independent Modbus RS485 serial communication ports, supporting standard Modbus RTU master-slave protocol
  2. Dedicated Modbus Plus industrial fieldbus interface for multi-controller interconnection and distributed remote I/O station communication
• Operating Environmental Temperature Range: Continuous stable working temperature from -20°C to +60°C
• Storage & Transportation Temperature Range: -25°C to +70°C
• Allowed Operating Relative Humidity: 10% to 90% relative humidity, zero condensation permitted in all working environments
• Overall Module Net Weight: 4.2 kilograms, including pre-installed backup lithium battery assembly
• EMC Compliance Standard: Fully complies with IEC 61000 industrial electromagnetic interference immunity standards for factory workshop operating environments

Function Features

1. Integrated all-in-one hardware architecture that combines CPU processing unit, rack power supply conversion circuit and memory backup battery assembly into a single module, eliminating separate power supply module installation steps for the main control rack and reducing overall cabinet wiring complexity
2. High-speed ladder logic execution performance with fixed 2ms per thousand nodes scan speed, supporting complex multi-loop PID closed-loop regulation arithmetic, matrix data movement operations, trigonometric function calculation and batch production sequence interlock logic execution
3. Complete dual-layer program protection mechanism, including physical key lock switch on module front panel and internal battery-backed memory storage; the physical lock switch can be locked and the key removed to block unauthorized personnel from uploading, downloading or modifying user control programs
4. Independent built-in real-time clock circuit powered by backup lithium battery, supporting accurate timing logic trigger, production run duration accumulation, equipment fault time stamp recording and automatic daily batch production program switching functions
5. Multi-layer industrial communication expansion capability, equipped with dual independent Modbus serial ports and Modbus Plus fieldbus interface simultaneously; dual Modbus ports can independently operate as master station to connect field transmitters and slave I/O modules, while Modbus Plus bus realizes data intercommunication between multiple 984 series PLC hosts and remote distributed I/O racks
6. Compatible with all full series Modicon 800 digital input, digital output, analog input and analog output expansion modules, supporting flexible mixed combination of digital and analog signal acquisition and control according to on-site equipment signal types
7. Built-in complete equipment self-diagnosis logic system, continuously detecting CPU core operating state, internal power supply voltage stability, backup battery residual capacity, communication bus line connection status and I/O rack bus communication faults; all detected fault codes and fault location information are stored in dedicated system registers for real-time upper computer monitoring and on-site maintenance troubleshooting
8. Support hot standby redundant control system configuration via Modbus Plus bus, realizing automatic master-slave CPU switching within fixed delay time when the main control CPU suffers hardware failure, ensuring uninterrupted continuous operation of critical production process equipment

Material Composition

• Outer Module Protective Casing: High-strength UL94-V0 flame retardant black reinforced ABS plastic with anti-static surface coating treatment, resistant to industrial dust, weak acid mist and mechanical collision impact damage
• Main CPU Control Printed Circuit Board: Multi-layer high-density FR4 high-temperature resistant fiberglass PCB board, all backplane bus gold finger contact pins adopt thick gold plating treatment to eliminate oxidation and maintain stable low-resistance electrical connection during long-term continuous rack-mounted operation
• Internal Power Conversion Circuit Components: Industrial-grade full-bridge rectifier chips, high-power switching transformers, low ripple output electrolytic capacitors and overvoltage/overcurrent protection thyristor components for AC-DC power conversion
• Memory Backup Power Components: Replaceable industrial-grade lithium primary battery with sealed anti-leakage metal shell, matched with battery voltage detection and low-battery alarm circuit
• Communication Interface Circuit Components: Isolated RS485 bus transceiver chips, Modbus Plus bus signal isolation optocoupler components and signal surge suppression TVS diodes for all external communication ports
• Signal Conditioning & Diagnosis Components: High-precision metal film sampling resistors, ceramic fixed filter capacitors and dedicated fault comparison operational amplifier chips for internal power supply voltage and battery capacity detection circuits
• Mechanical Fastening & Conductive Components: Nickel-plated copper alloy conductive bus contact strips, stainless steel anti-loosening rack fixing screws and copper foil heat conduction patches attached to high-power power conversion chips for passive natural heat dissipation

Structural Characteristics

• Installation Mounting Form: Standard 19-inch industrial control cabinet rack-mounted fixed installation, compatible with universal 19-inch cabinet rack guide rail standards; vertical upside-down installation and side inclined installation are strictly prohibited
• Overall Module External Dimensions: Width 280mm, Height 160mm, Depth 220mm
• Front Panel Layout Design
  1. Independent LED status indicator light groups for power supply operation state, CPU program running state, communication bus connection state and system fault alarm state; each indicator lamp corresponds to fixed equipment working state definition for rapid on-site visual judgment
  2. Physical program lock key switch with removable key to restrict program modification access permission
  3. DIP dial switch operation window with detachable transparent plastic protective cover, used for AC input voltage range switching and Modbus communication baud rate parameter configuration
  4. Detachable battery replacement cover plate, convenient for on-site maintenance personnel to replace the internal lithium backup battery without disassembling the entire module from the cabinet rack
• Internal Circuit Zoning Layout
  1. Front PCB zone: CPU core logic processing circuit, real-time clock circuit and program memory storage components
  2. Middle PCB zone: AC-DC switching power conversion circuit, equipped with independent passive heat dissipation copper foil patches for high-power heat generation components
  3. Rear PCB zone: Modbus serial communication bus circuit, Modbus Plus fieldbus interface circuit and backplane rack bus connection gold finger assembly
  4. Internal metal electromagnetic shielding partition plates separate high-power power conversion circuits, digital CPU logic circuits and weak signal communication circuits to eliminate mutual electromagnetic crosstalk interference
• Rear Backplane Connection Structure: Rear side of the module is equipped with multi-row gold finger bus connector, directly inserted into the dedicated backplane slot of Modicon 800 series I/O expansion racks, completing mechanical fixed locking and bidirectional high-speed data communication connection between CPU and all I/O expansion modules on the rack