KEBA OF457A K2-400

Core Technical Performance Parameters

• Model Definition: OF457A = Motion CPU Hardware Version; K2-400 = Kemro K2 Injection Molding Control Platform Standard Performance Grade
• Dual-Core Processor Architecture: Real-Time Motion Control Core (1.2GHz Industrial RISC Processor) + PLC Logic Control Core (800MHz Industrial Processor)
• Maximum Supported Synchronous Motion Control Axes: 32 Independent Servo Axes
• Motion Control Interpolation Cycle Minimum: 0.1ms High-Speed Closed-Loop Interpolation
• Built-in Injection Molding Dedicated Algorithm Library: Injection Pressure Closed-Loop Control, Screw Plasticizing Backpressure Control, Mold Clamping Low-Speed Cushion Protection, Ejection Multi-Stage Speed Pressure Control, Mold Core Pull Interlock Logic
• Real-Time Industrial Bus Communication Protocols Supported: EtherCAT, Profinet, Modbus TCP/IP, Modbus RTU
• Digital I/O Process Data Scan Cycle Minimum: 0.2ms
• Program Memory Capacity: 8 GB Industrial Grade Flash Storage
• Real-Time Production Data Storage Capacity: 4 GB Flash Memory for historical molding parameter curve, fault log, production batch yield data
• Operating Power Supply Voltage: 24 VDC ±10%
• Module Operating Power Consumption: Max 18 W under full multi-axis interpolation load
• Operating Ambient Temperature: -20°C ~ +60°C
• Storage Temperature: -40°C ~ +85°C
• Relative Humidity: 5% ~ 95% Non-Condensing, Oil Mist & Dust Resistant Industrial Grade
• Physical Dimensions (L×W×H): 165 mm × 90 mm × 45 mm
• Net Module Weight: 0.48 kg
• Installation Standard: 35mm DIN Rail Cabinet Mounting
• Certification Standards: CE, UL, TÜV Rheinland Functional Safety, RoHS Industrial Equipment Directive

Functional Feature Highlights

1. Dual independent industrial processor core design: dedicated high-speed motion control core exclusively responsible for multi-axis servo closed-loop interpolation, position, speed, pressure real-time closed-loop calculation; separate logic control core executes equipment interlock logic, safety circuit detection, production data recording, human-machine interface data interaction, two cores run in parallel without resource competition, guaranteeing ultra-stable motion control cycle without jitter
2. Professional pre-built injection molding dedicated motion algorithm library, all core molding process control logic solidified inside the CPU module firmware, no complex secondary programming required by equipment manufacturers; one-click parameter tuning for injection backpressure, mold clamping buffer protection, ejection multi-stage speed switching, greatly shortening injection molding machine equipment development and commissioning cycle
3. Supports up to 32 independent servo axes synchronous linear, circular, spline multi-segment continuous interpolation motion control, perfectly matched all-electric injection molding full servo multi-axis coordinated operation requirements; supports electronic cam, electronic gear synchronization function for screw plasticizing and injection axis synchronous coordination
4. Multi-channel real-time industrial bus communication interface integrated standard, simultaneously supports EtherCAT high-speed servo bus, Profinet factory automation bus, Modbus TCP Ethernet communication, Modbus RTU serial bus; can simultaneously connect servo drives, HMI touch panels, remote I/O stations, factory upper computer MES production management system to realize full equipment data interconnection
5. Built-in large-capacity industrial flash storage, automatic real-time record all injection molding production batch parameters, cavity pressure curve historical data, equipment fault alarm time sequence log, production yield statistical data; data can be exported to USB storage device or uploaded to MES system through Ethernet for production quality traceability analysis
6. Complete multi-level safety logic control function integrated: mold clamping high-pressure safety interlock, ejection mold collision prevention logic, injection pressure over-limit safety stop, servo drive communication loss emergency stop, equipment door safety switch interlock; all safety logic adopts dual-channel redundant detection circuit to meet industrial machinery functional safety standards
7. Standard DIN rail modular cabinet installation, hot-swappable backplane bus connection design; CPU module can be plugged and replaced while the injection molding machine control cabinet main power supply remains powered on, no full production line shutdown required for maintenance replacement
8. Rich configurable peripheral expansion compatibility: matched with KEBA OP series human-machine operation panels, K2 series digital/analog I/O expansion modules, hydraulic proportional valve control modules, EtherCAT servo bus coupler modules, forming a complete full-set injection molding machine automation control system solution

Material Composition & Structural Characteristics

1. Module Outer Protective Housing: Black high-strength PA66 glass fiber reinforced flame retardant plastic shell, UL94-V0 fire resistance grade, anti-oil mist, anti-dust industrial surface coating treatment
2. Internal Dual-Core Control Circuit Board: 8-layer FR4 high-density multi-layer fiberglass PCB, full copper foil electromagnetic shielding layer between motion control core and logic control core circuit areas to eliminate internal high-speed signal crosstalk interference
3. Industrial Processor Core Chips: Two automotive-grade wide-temperature range RISC industrial microprocessors with built-in hardware floating-point arithmetic units for high-speed motion interpolation calculation
4. Storage Components: Industrial wide-temperature SLC type NAND Flash memory chips, resistant to frequent repeated erasing and writing of production historical data without data loss
5. Communication Interface Connectors: Gold-plated RJ45 Ethernet communication sockets, 9-pin D-SUB Modbus RTU serial communication connectors, 4-pin terminal block 24VDC power supply interface
6. DIN Rail Mounting Locking Mechanism: Elastic spring steel metal buckle on the module bottom, firmly clamped on standard 35mm DIN rail to avoid module sliding caused by cabinet long-term vibration
7. Heat Dissipation Structure: Hollow grid plastic shell design, natural convection air flow channel for internal processor chip heat dissipation; no built-in cooling fan, maintenance-free long-term continuous operation