Product Short Description
Product Brief IntroductionJRMSI-120XBP01200 is Yaskawa industrial rack dedicated servo power backplane expansion interface board, used inside large-scale JRMSI multi-axis servo control rack systems. It distributes main three-phase AC power supply to all rack-mounted servo drive modules, transmits high-speed differential motion bus signals between CPU control boards and individual servo axes, provides standardized power distribution and signal routing expansion for up to 12 servo drive slots in a single rack unit.
Description
Core Technical Specifications & Performance Parameters
- Rack Slot Capacity Support
Accommodate maximum 12 independent servo drive modules per backplane board
- Main Power Distribution Rating
Three-phase AC input voltage range 200 VAC – 480 VAC; total maximum distribution current 120 A continuous
- Backplane Signal Bus Performance
Differential high-speed motion control bus, signal transmission refresh cycle 250 μs, isolation voltage 2000 VAC between power distribution circuit and control signal circuit
- Auxiliary Logic Power Distribution
Integrated 24 VDC logic power bus distribution for all rack control and communication modules
- Overcurrent Protection Rating
Embedded bus current monitoring circuit with hardware fuse overcurrent protection per slot
- Environmental Operating Parameters
Operating temperature 0 °C ~ +55 °C; non-condensing humidity 5% – 90%; vibration resistance IEC 60068-2-6
- Physical Dimension & Weight
Full rack width backplane PCB: 600 mm (width) × 320 mm (height) × 15 mm (depth); net weight 2.7 kg
Material Composition & Structural Features
- Main backplane substrate: Extra-thick copper layer FR4 PCB to carry high three-phase power current without excessive voltage drop
- Connector components: Gold-plated multi-layer edge card slots for servo drive module insertion; high-current copper bus bar terminals for main three-phase AC power input
- Internal structure separation: Physical isolation partition between high-current power distribution zone and low-voltage control signal bus zone to eliminate electromagnetic crosstalk
- Protection hardware: Replaceable slot-by-slot current limiting fuses, surface-mount surge suppression TVS diodes on all signal bus lines
- Mounting structure: Pre-drilled mounting holes for secure fixation inside standard Yaskawa JRMSI industrial rack cabinet
Working Principle
Application Scenarios
- Automotive automated production welding, painting multi-servo production lines
- Lithium ion battery factory full-automatic winding, slitting, stacking high-speed multi-axis equipment
- Large gantry CNC machine tools, automated optical inspection AOI multi-axis positioning platforms
- Packaging industry high-speed blister filling, carton forming multi-servo synchronous production lines
Installation Requirements
- Install horizontally as base layer inside Yaskawa JRMSI standard industrial rack cabinet, fixed with stainless steel bolts to resist production line vibration
- Main three-phase power input cable copper cross-section minimum 16 mm² for full 12-slot maximum current load
- Maintain 50 mm vertical clearance above backplane board for natural heat dissipation of high-current power traces
- Cabinet must be equipped with top exhaust cooling fan to control internal rack temperature below 55 °C under full load
- Rack main PE ground bus connected directly to backplane dedicated grounding terminal with 6 mm² copper ground wire
Operation & Maintenance Precautions
- Complete full rack main power shutdown before any servo drive insertion/removal operation; live hot plug forbidden to avoid backplane trace burnout
- Replace blown slot fuses only with Yaskawa original specified current rating fuses; oversized fuses cause fire hazard
- Inspect all power terminal tightening torque every 6 months during scheduled equipment maintenance to prevent loose connection overheating
- Do not modify backplane PCB wiring traces or add external power taps without official factory approval
- Keep rack cabinet door fully closed during operation to prevent conductive metal dust accumulation on backplane circuit surface







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