ASYST HS80-01 9700-4774-01

Technical Specifications

• Wafer Handling Size: Standard 200mm silicon wafer compatible
• Arm Movement Axis: R-axis rotation, Z-axis vertical lift, X-axis linear extension
• Operating Environment: Class 1 ultra-cleanroom, vacuum chamber compatible variant
• Drive Type: Miniature brushless DC servo micro-motors with integrated miniature encoders
• Part Number Breakdown: HS80-01 = base model robot arm; 9700-4774-01 = full integrated assembly including end effector, wiring harness, drive sub-board
• Max Arm Extension Stroke: 320mm linear travel
• Positioning Repeatability: ±0.002mm wafer placement precision

Functional Features

1. Zero-particle generation ultra-clean mechanical transmission design for semiconductor fabrication
2. Multi-axis synchronous motion control for high-speed low-vibration wafer transfer
3. Non-contact electrostatic dissipation integrated end effector to eliminate wafer static damage
4. Built-in wafer presence optical sensor to detect missing or skewed silicon substrates
5. Hermetic internal wiring routing to avoid particle shedding inside process chamber

Performance Parameters

• Max transfer cycle time: 1.8 seconds single wafer pick-place full cycle
• Operating cleanroom temperature: 18°C ~ 24°C constant temperature
• Vibration emission: <0.01μm RMS particle generation during full-speed operation
• Continuous operating lifespan: 40,000,000 wafer transfer cycles
• Vacuum operating pressure range: 1×10⁻⁷ Pa to atmospheric pressure
• Relative humidity operation limit: 30% ~ 50% RH controlled cleanroom

Material Composition

• Arm structural frame: Aerospace grade anodized aluminum alloy with hard coat low-particle coating
• End effector wafer contact surface: High-purity PEEK medical/semiconductor grade polymer
• Drive gear assembly: Ceramic precision anti-wear gear set, zero metal particle shedding
• Internal wiring: Fluoropolymer insulated ultra-clean shielded cable
• Sealing components: Perfluorinated elastomer vacuum compatible O-rings

Structural Characteristics

• Collapsible multi-section telescopic linear arm structure
• Integrated compact servo drive sub-board mounted inside arm base housing
• Top-mounted optical wafer detection sensor integrated on end effector tip
• Central vacuum suction channel built into PEEK end effector for non-contact wafer holding

Working Principle

Advantage Highlights

1. Class 1 ultra-low particle emission meets advanced semiconductor fabrication cleanliness standards
2. Sub-micron repeatability eliminates wafer misalignment risk during lithography, etching, deposition process transfer
3. Dual vacuum and atmospheric chamber dual compatibility reduces equipment platform hardware variant types
4. Integrated full assembly PN 9700-4774-01 supplies complete arm, wiring and drive subassembly without separate part sourcing
5. Ceramic gear transmission eliminates metal wear debris contamination in clean process environment

Applicable Industries

Installation Requirements

1. Installation only inside certified Class 1 cleanroom with full anti-static gown and glove protocols
2. Mount base assembly to equipment vibration isolation platform with specified 6 N·m bolt torque
3. All wiring harness routing fixed with cleanroom certified PTFE cable clamps only
4. Vacuum supply line connected with metal face-seal fittings to avoid plastic particle contamination
5. Calibrate arm positioning zero point after full mechanical installation before equipment startup

Operation & Maintenance Precautions

1. Disassembly only permitted inside dedicated clean maintenance mini-environment
2. Contact PEEK end effector surface strictly prohibited without Class 10 nitrile gloves
3. Monthly vacuum channel leak test to eliminate partial suction wafer drop risk
4. Replace ceramic gear lubricant every 10 million transfer cycles with semiconductor-grade fluorinated grease only
5. Any particle contamination detected requires full arm ultrasonic cleaning per factory service procedure