Metso D201832L

Technical Specifications

• Model Series: ACN CS D2018 Main Processor Subseries L Extended Variant
• Power Input: 24 VDC ±10, rated power consumption 17 W
• Main Processing Chip: 32-bit industrial dual-core RISC processor consistent with D201832
• Onboard Memory: 512 KB RAM, 2 MB Flash program storage
• Backplane Bus Master Control: Full ACN bus scheduling authority
• External Communication Ports: 1 × Ethernet RJ45, 1 × RS485 Modbus RTU (L-type reinforced drive circuit)
• Supported Logic Execution Cycle: Minimum 1 ms real-time control cycle
• Max Field Communication Cable Length: 300 m shielded twisted pair (L exclusive)
• Operating Temperature Range: -20 °C ~ +60 °C
• Storage Temperature Range: -40 °C ~ +85 °C
• Humidity Tolerance: 5%–95% non-condensing
• Protection Grade: IP20 module body, IP54 full rack assembly
• Dimensions: 220 H × 160 W × 35 D mm
• Net Weight: 0.89 kg

Functional Features

1. Identical dual-core real-time control logic performance as base D201832 model
2. L-type multi-layer copper full-board EMC shielding eliminates long-distance cable interference
3. Reinforced RS485 communication drive circuit for ultra-long-distance field bus transmission
4. Complete master scheduling authority over all ACN backplane slave I/O modules
5. Onboard large-capacity Flash memory for control logic and system configuration storage
6. Multi-level hardware watchdog circuit for automatic fault recovery under program deadlock
7. Front panel full set of power, run, fault, communication LED status indicators

Performance Parameters

• Logic Execution Speed: 0.1 μs per basic logic instruction (consistent with D201832)
• Max Supported Rack I/O Channel Count: 128 combined analog/digital channels
• Ethernet Communication Rate: 10/100 Mbps auto-adaptive
• Surge Withstand Capacity: 4 kV ESD contact discharge (2x higher than standard D201832)
• Vibration Resistance: 10–150 Hz, 1 g continuous operation
• Long-distance Bus Signal Attenuation: ≤ 5% at 300 m wiring length

Material Composition

• PCB Substrate: FR4 high-Tg multi-layer industrial fiberglass circuit board
• Communication Connectors: Industrial shielded gold-plated RJ45 and RS485 terminals
• Processor Core: Wide-temperature dual-core RISC industrial chip
• Shield Frame: 1.2 mm double-layer cold-rolled steel full enclosure shielding (L exclusive upgrade)
• Mounting Frame: Black extruded aluminum alloy hard anodized anti-corrosion coating

Structural Characteristics

• Standard 1U dual-latch plug-in rack master slot dedicated structure
• Front panel identical LED indicator layout to D201832 standard model
• Rear gold finger full ACN backplane master bus interface
• L-type independent double-layer shielding compartment for communication drive circuits
• Reinforced aluminum heat dissipation fin for core chip temperature control

Working Principle

Advantage Highlights

1. Double-layer full-board EMC shielding supports up to 300 m field communication wiring without repeaters
2. Reinforced RS485 drive circuit eliminates long-distance bus signal distortion and loss
3. Identical control logic performance as standard D201832 model, fully software compatible
4. Higher surge withstand capacity adapts to strong electromagnetic interference industrial sites
5. Full mechanical and electrical interchangeability with D201832 base model for rack replacement
6. Single-slot master design without additional external signal amplification hardware

Applicable Industries

Installation Requirements

1. Install exclusively in dedicated master slot of Metso ACN CS 8/16-slot standard rack
2. Maintain 10 mm vertical ventilation gap between adjacent modules for heat dissipation
3. All external communication cables adopt double-shielded twisted pair wiring, single-point cabinet PE grounding
4. Cabinet PE grounding resistance ≤ 4 Ω to fully activate L-type shielding performance
5. Stabilize rack backplane 24 VDC power before hot-swapping master module
6. Control cabinet internal continuous operating temperature controlled below 55 °C

Operation & Maintenance Precautions

1. ESD anti-static wrist strap mandatory during module disassembly and wiring
2. Complete full program backup before replacing master controller module
3. Conduct semi-annual inspection of communication terminal block screw tightness
4. Strictly separate communication cables from high-power motor/inverter wiring channels
5. Spare D201832L modules stored in sealed anti-static packaging with desiccant packs
6. Cut off all external communication cable power before disassembling wiring terminals