Product Short Description

  • Product Name: Semiconductor Process Specialty Component
  • Product Brief: Precision engineered core component dedicated for semiconductor wafer processing equipment, manufactured to meet high-purity and high-reliability standards for wafer fabrication environments.

Description

  • Technical Specifications: Designed for ultra-clean semiconductor fab operating environment; Comply with semiconductor industry SEMI standard; Dimensional tolerance meets micron-level precision requirements; Rated for continuous operation under vacuum and high-purity gas atmosphere.
  • Functional Features: Supports stable gas delivery, vacuum system operation and process parameter control in wafer etching, deposition and thin-film manufacturing processes; Realizes precise flow and pressure regulation.
  • Performance Parameters: Operating temperature range: 0°C ~ 85°C; Operating pressure range: Vacuum to 1.0 MPa; Service life: Long-term continuous operation over 80,000 working hours; Pollution level: Class 1 ultra-low particle emission.
  • Material Composition: Main body adopts high-grade 316L stainless steel; Sealing parts use fluoropolymer and high-purity elastomer; Internal flow channel with electropolished surface treatment.
  • Structural Characteristics: Integrated compact structure; One-piece forming main frame; Optimized internal flow channel design to eliminate dead space; Standard interface for quick assembly and disassembly.
  • Working Principle: Conducts and regulates process gas and vacuum pressure inside semiconductor equipment via internal precision flow channels and matching structural components, cooperating with the main control system to maintain stable process conditions for wafer production.
  • Advantages & Highlights: Ultra-low particle generation, no medium contamination; Excellent corrosion resistance to semiconductor process gases; High structural stability, no deformation under long-term vacuum and temperature cycling; Fully compatible with mainstream LAM semiconductor process tools.
  • Applicable Industries: Semiconductor manufacturing, Integrated circuit (IC) fabrication, Wafer processing, Microelectronics production.
  • Model Series: LAM Semiconductor Process Core Component Series
  • Installation Requirements: Install in Class 100/Class 10 ultra-clean workshop; Use professional vacuum sealing tools for assembly; Strictly align installation interfaces; Torque value follow factory standard specification.
  • Usage Notes: Prohibit contact with corrosive liquid and particulate pollutants before installation; Regularly inspect sealing performance and surface integrity; Do not disassemble in non-clean environment; Avoid impact and extrusion during transportation and installation.

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