Product Short Description

Product Name: LAM Research Semiconductor Process Component 810-810202-013

Model Series: LAM 810 Series Semiconductor Core Parts

Product Brief: Multi-functional composite sensor assembly for LAM semiconductor equipment, integrating temperature, position and micro-pressure detection functions.

Description

Technical Specifications:
  • Temperature Detection Range: 0°C ~ 150°C, detection accuracy ±0.8°C
  • Position Detection Range: 0 ~ 50mm, detection accuracy ±0.01mm
  • Micro-pressure Detection Range: 0 ~ 10kPa, detection accuracy ±0.2kPa
  • Output Signal: Standard 4-20mA analog signal

    Functional Features: Real-time detection of equipment internal temperature, mechanical position and tiny air pressure; synchronous signal output to main control system; over-threshold early warning.

    Performance Parameters:

  • Continuous Detection Stability: No parameter drift within 24 hours continuous work
  • Response Speed: All detection items response time ≤8ms
  • Electromagnetic Compatibility: Pass SEMI standard EMC test

    Material Composition: Stainless steel probe shell, high-precision sensing chip, high-temperature resistant wire, epoxy resin sealing layer.

    Structural Characteristics: Integrated three-in-one sensing structure, external thread fixed installation structure, fully sealed waterproof and dustproof structure, centralized signal output terminal.

    Working Principle: Induce physical changes of temperature, position and pressure through internal sensitive components; convert physical signals into standard electrical signals and output; trigger early warning when detected values exceed set threshold.

    Advantages & Highlights: Multi-parameter integrated detection, high detection precision, fast response, fully sealed protection, strong environmental adaptability, unified signal output.

    Applicable Industries: Semiconductor intelligent process equipment, automatic detection system of production line, microelectronics precision monitoring equipment.

    Installation Requirements: Screw into equipment reserved detection hole; keep detection probe contact surface clean; connect signal lines in accordance with circuit definition; complete parameter calibration after installation.

    Usage Notes: Probe surface is prohibited from collision and scratch; regular calibration of detection parameters every 12 months; avoid long-term exposure to ultra-high temperature environment; replace immediately if signal is abnormal.

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