Product Short Description

Product Name: LAM Research Semiconductor Process Component 810-102361-222

Model Series: LAM 810 Series Semiconductor Core Parts

Product Brief: Standard precision mechanical & electronic assembly part exclusively designed for LAM Research semiconductor etching and deposition process equipment, serving as a key matching component for wafer processing production lines.

Description

Technical Specifications:
  • Dimension: Standard customized size matching LAM 800/810 equipment chassis
  • Operating Voltage: 24V DC rated
  • Operating Temperature: 10°C ~ 65°C continuous working range
  • Working Humidity: 10% RH ~ 85% RH (non-condensing)

    Functional Features: Implements signal transmission, mechanical positioning and auxiliary clamping functions during semiconductor wafer processing; supports continuous cyclic operation of production equipment.

    Performance Parameters:

  • Service Life: 50,000+ hours rated continuous operation
  • Vibration Resistance: Compliant with SEMI S2 standard semiconductor equipment vibration level
  • Positioning Accuracy: ±0.01mm

    Material Composition: High-grade aerospace aluminum alloy main body, food-grade fluorine rubber sealing ring, copper alloy conductive terminals, anti-corrosion engineering plastic auxiliary structural parts.

    Structural Characteristics: Integrated modular structure, split assembly design, built-in positioning pin and anti-loosening fastener, fully enclosed dustproof structure.

    Working Principle: Realizes mechanical limit and electrical signal conduction through physical contact and circuit connection; cooperates with host equipment to complete wafer positioning, locking and status feedback actions in process flow.

    Advantages & Highlights: High positioning precision, excellent anti-corrosion and dustproof performance, long service life, easy disassembly and maintenance, full compatibility with original LAM equipment.

    Applicable Industries: Semiconductor manufacturing, integrated circuit (IC) production, wafer fabrication, microelectronics manufacturing.

    Installation Requirements: Install on reserved mounting position of LAM 810 series process equipment; use original matching fasteners; torque control at 8–10 N·m; ensure horizontal installation without tilt.

    Usage Notes: Strictly prohibit disassembly during equipment running; avoid contact with strong acid, strong alkali and organic solvent; regular surface dust removal every 30 working days; replace sealing parts every 24 months.

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