Product Short Description

  • Product Name: Semiconductor Equipment Gas Pipeline Component
  • Brief Introduction: Precision pipeline connecting part for LAM semiconductor process gas delivery system, used for high-purity gas transmission.
  • Technical Specifications: Design pressure 1.0 MPa, working vacuum 1×10⁻⁷ Torr, operating temperature 0 °C to 125 °C, pipeline inner diameter 4 mm.

Description

  • Functional Features: Conveys high-purity process gas, realizes pipeline switching, flow guidance and sealing connection; adapts to multiple semiconductor process gases.
  • Performance Parameters: Gas purity retention rate 99.999%, leakage rate ≤ 1×10⁻⁹ sccm/sec, service life ≥ 42,000 hours.
  • Material Composition: Electropolished 316L stainless steel pipe body + PTFE sealing parts + high-purity alloy connectors.
  • Structural Characteristics: Elbow integrated structure, internal smooth polishing, ferrule-type quick connection, full flow channel design without dead space.
  • Working Principle: Transports high-purity process gas to semiconductor reaction chamber under controlled pressure, keeps pipeline internal clean and no residual gas.
  • Advantages: Ultra-smooth inner wall no particle shedding, excellent high-purity gas adaptability, zero dead volume, reliable sealing performance.
  • Applicable Industries: Semiconductor manufacturing, wafer processing, thin film deposition, electronic material production.
  • Series Information: LAM 810 Series Process Gas Pipeline Components, 016 is special angle pipeline version.
  • Installation Requirements: Complete pipeline assembly in cleanroom; use special ferrule fastening tool; do not bend the pipe body forcibly.
  • Usage Precautions: Purge pipeline thoroughly before formal use; prohibit conveying corrosive super-strong medium; inspect joint tightness regularly.

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